FAQs

Explore How Liquid Cooling Can Work for You

Liquid cooling is a growing technology that mitigates rising heat densities that traditional air-cooling technology can no longer effectively address. These increases in heat density are largely driven by increasing chip performance for AI and compute-dense data center applications. Compared to air, liquid cooling can offer 3,000 times more heat absorption; however, most liquid cooling solutions require a costly retrofit or entirely new facility to operate effectively.

Our solution doesn’t require a drastic overhaul of your existing infrastructure to provide direct and continued generational cooling. NeuCool’s innovative two-phase direct-to-chip approach allows vaporators (engineered cold plates) to readily integrate into high-performance servers, and its innovative iCDU, manifolds, and other system elements to install onto modern racks.
NeuCool’s system architecture is robustly engineered to maximize system thermal performance and lifetime value while preventing leaks often present in single-phase, water-based liquid cooling. Our scalable, North American-based supply chain delivers faster response times to our data center customers and partners when needed.

Finally, our cooling power is simply unmatched among our direct competitors. NeuCool’s two-phase technology sets the industry standard at 4500W+ per socket, which is considerably over the limit needed to cool powerful chips such as NVIDIA’s B200/B300 GPUs and AMD’s MI350X and MI355X GPUs.

We currently work with a robust ecosystem of Channel Partners (CP), Authorized Service Partners (ASPs), integrators, and OEMs. Current partners include Equinix, Vertiv, Unicom Engineering, Celestica, Supermicro, Computacenter, and Silverback Data Center Solutions.

We continue to strategically build out trusted partnerships and collaborative initiatives that drives scale (geographically and volumetrically), depth and value for our collective data center and edge compute customers.

Great news—we have deployments across the U.S., Canada, and Europe. Right now, you’re able to see NeuCool™ in action at the following Co-Innovation Labs:

  • Telehouse’s Liquid Cooling Lab in London, UK
  • iM Data Centers’ facility in Miami, US
  • Nordik Data Centers’ next-gen AI data center in Montreal, CA
  • Global Switch’s showroom in London, UK
  • Equinix’s Co-Innovation Facility in Ashburn, US

Check this section regularly; we’ve got exciting deployments on the near horizon.

We’ve integrated and tested our NeuCool system with a variety of top-tier server OEMs, including Dell, Supermicro, Lenovo, Flex, and Jabil.

We continue to expand our server OEM partnerships and portfolio because we’re able to work with virtually any OEM server brand and model, which is part of the inherent scalability benefits of our system. This is largely due to our in-house R&D, engineering, and manufacturing capabilities that deliver superior responsiveness to meet our customers and partners’ liquid-cooling needs.

NeuCool’s in-rack solution has the unmatched ability to cool 4500W+ per socket and currently enables up to 100kW per rack. Our multi-rack solution cools 250kW across up to four racks.

Our NeuCool systems can utilize two different high-performance refrigerants, supplied by Honeywell:

  • NeuCool Eco+, R-1233zd(E): Our most environmentally friendly fluid that still delivers exceptional performance.
  • NeuCool Performance+, R-515B: Our highest preforming fluid that still meets the data center industries sustainability requirements.

Both refrigerants are dielectric, non-corrosive and ASHRAE A1 safety rated. They are also environmentally friendly, with 0 ozone depletion potential and low GWP. Additionally, due to the properties of these refrigerants, there is no fluid quality testing, chemical additives or filter changes required.

We have selected these coolants based on their thermal performance, safety and sustainability for our 2-phase, direct-to-chip liquid cooling application. These refrigerants, however, are also used in other applications such as data center chillers, industrial processes, and comfort cooling. The broad use of these refrigerants helps ensure low costs and adherence to the most stringent regulatory requirements around the world.

Our in-rack and multi-rack Intelligent Coolant Distribution Units (iCDUs) are Accelsius engineered CDUs designed and optimized for two-phase, direct-to-chip liquid cooling systems. They include a diagonal touchscreen with detailed system controls and management capabilities as well as targeted status LEDs. The iCDUs ensures maximum system uptime with robust components, enterprise-grade design, and multiple system redundancies alongside operating serviceability (hot-swap) capabilities. The iCDUs eliminate the need for redundant CDUs as well as the challenges associated with determining interoperability.

Our NeuCool system operates under a wide range of available facility water temperatures. We can cool CPUs at >350 watts using 45℃ (or 113℉) water and still have ample headroom before the throttle point. Testing shows that NeuCool’s two-phase, direct-to-chip system can cool TDPs of 4500+ watts and a 250kW/rack with 40℃+ FWS. This cooling capability, coupled with our 6-8℃ higher inlet water temperature, enables OpEx savings of up to 32% vs single-phase direct-to-chip deployments.

No! We’re working with partners and customers on developing a refrigerant-to-air solution that can be retrofitted into existing facilities without facility water. Get in touch with us to learn more today, or check back in, in early 2026!

Incredibly easy! 85% of the iCDU components are hot-swappable, which includes our enterprise-grade pumps, boards, power supplies, and sensors. Over 80% of potential servicing requires no HVAC or special certifications to conduct service, while service and support protocols remain the same.

Finally, our Ascent Model is designed to guide our customers along the journey to 2-phase, direct-to-chip cooling, and offers a staged, scaled adoption program to reduce risk via defined checkpoints. The NeuCool system, support programs, and professional services are configured and optimized to meet your data center’s specific operational needs.

Our NeuCool reservoir houses a leak detection system facilitated by redundant sensors, which monitor refrigerant levels and other parameters during operation. The NeuCool system reports and alerts in the event of detected leaks. It’s important to note that the dielectric refrigerant we use won’t damage servers or other electronic equipment in the unlikely event of a leak. 

Facility water only passes through the NeuCool system via the condenser in the iCDU in the bottom of the server rack, preventing potential damage to servers or other IT equipment in the event of a facility water leak. The iCDU contains a leak detection system that will sense any facility water leaks and trigger the appropriate NeuCool system response.

While immersion may eventually have a viable application, most data centers have discovered that direct-to-chip (DTC) and, most notably, Accelsius have key advantages over immersion. These include: 

  • Immersion cooling’s unfamiliar form factor and service protocols require infrastructure changes, costly equipment investment, and special training. 
  • Single-phase immersion struggles to extend beyond the 400 watt/socket limit, and two-phase immersion requires high costs for high volumes of refrigerant that’s subject to regulation. For example, 1,300 liters of immersion tank coolant costing tens of thousands per tank, whereas NeuCool utilizes only 30 liters of refrigerant per rack. 
  • Server and processor OEMs are promoting direct-to-chip liquid cooling solutions, while immersion faces a tougher route to acceptance due to the dismantling of the server itself. 

In two-phase cooling, liquid reaches its boiling temperature and starts evaporating. In addition to the same heat transfer mechanisms active in single-phase cooling, the generation of bubbles on the cold plate surface further enhances the heat transfer by providing improved mixing and increased convective heat transfer.

This enhancement in the heat transfer mechanism means that more heat can be extracted at the same temperature difference, so you can get more power out of your chips if you use two-phase cooling.

Additionally, boiling takes place at a constant temperature and a large amount of energy can be stored. As a quick comparison, the amount of energy that can be stored by boiling our NeuCool Eco+ Refrigerant (R1233zd) corresponds to a 42°C rise in single-phase water cooling at the same flow rate. Therefore, two-phase cooling requires lower flow rates to extract a target heat load, and the chips will have uniform temperatures.

Recent third-party analysis from Jacobs Engineering has indicated that a 10MW data center cooled by two-phase direct-to-chip liquid cooling would deliver comparable CapEx, a 35% lower OpEx, and a 12% lower TCO compared to single-phase direct-to-chip. This difference in savings can be largely attributed to the basic mechanical differences between single- and two-phase DTC.

A key differentiator between single-phase and two-phase cooling is two-phase’s ability to take advantage of latent heat of vaporization, which greatly enhances its heat removal capability. Our two-phase, DTC system has been tested to >4,500W with an appropriately sized TTV, which greatly exceeds planned thermal flux limits. 

To keep up with two-phase’s heat removal via liquid and vapor, single-phase cooling would need to drastically raise its flow rate and resulting pressure, which increases the risk of leakage and corrosion of vital components, and/or significantly lower required facility water temperatures, which increases energy use and the associated cost of electricity.

We’re actively scaling the business to meet current and planned demand and have multiple partners that will address high-volume orders. Our supply chain is structured to respond to scale including larger orders and bigger deployments.

Yes! Tell us more about your project and timeline. We’re happy to work to get an NDA in place so that we can better understand your program requirements and align our thermal solutions accordingly.

CPUs:

  • Intel Sapphire Rapids
  • Intel Emerald Rapids
  • AMD EPYC Genoa
  • AMD EPYC Turin
  • NVIDIA Grace

GPUs:

  • NVIDIA H100
  • NVIDIA H200
  • AMD MI325X
  • AMD MI355X
  • NVIDIA B200