In the News

Unicom Engineering & Accelsius Podcast: Cooling The AI Revolution

Join Accelsius CTO Dr. Richard Bonner in a discussion with Unicom Engineering on the ways…

Liquid Cooling with Pete Sacco (INTUVA CEO & Founder) and Liz Cruz (Accelsius CMO)

As data centers evolve to meet the demands of AI and HPC workloads, traditional air-cooling…

Data Centre Solutions Interview with Accelsius Solution Architect Simon Brady

Accelsius’ Solution Architect Simon Brady sat down with Data Centre Solutions to illustrate how our…

OCP Educational Webinar: Powering and Cooling Large Scale AI Clusters

This OCP webinar discussed the challenges of powering and cooling large-scale high-density 250kW+ per rack…

Thermal Management Expo Europe 2024 Speaker Interview: Simon Brady, Accelsius

Solution Architect Simon Brady discusses our NeuCool two-phase direct-to-chip liquid cooling technology, designed to address…

Accelsius and OCP Webinar: Innovating Two-Phase Cooling for Data Centers

Liz Cruz breaks down the reasons why two-phase, direct-to-chip is prepared to meet the data…

The Picks and Shovels Businesses Quietly Driving the AI Build Out

Explore the unsung heroes behind the AI revolution: the businesses providing essential infrastructure for AI’s…

How to combine innovative technology with practical reliability

CRO Dino Foderaro discusses the new era of data center cooling technology, offering capacity tested…

CPUs:

  • Intel Sapphire Rapids
  • Intel Emerald Rapids
  • AMD EPYC Genoa
  • AMD EPYC Turin
  • NVIDIA Grace

GPUs:

  • NVIDIA H100
  • NVIDIA H200
  • AMD MI325X
  • AMD MI355X
  • NVIDIA B200